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Abrasives for Electronics Finishing

3M™ Diamond Pad Conditioners for CMP


3M™ Diamond Pad Conditioners

Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protusion to produce a consistent finish, with superior diamond retention to reduce scratching.

Key features and benefits:
  • Lower cost of ownership
  • Optimized for extended pad and disk life
  • Flat area of active diamonds for low non-uniformity
  • Exclusive polymer substrate enhances corrosion resistance
  • Diamonds secured with both chemical and mechanical bonds for superior retention
ProductsProduct DocumentationApplication Tips
Type of Chemical Mechanical Planarization (CMP)
Oxide Cu Tungsten Pad Conditioner Format
3M Product No. Bulk Barrier 4.25 in diam 4 in diam 360mm diam 260mm diam 10 in diam Bar
A160 Diamond Pad Conditioner X X X
A165 Diamond Pad Conditioner X X X X
A4-55 Diamond Pad Conditioner X X
A82 Diamond Pad Conditioner X X
A98 Diamond Pad Conditioner
A153L Diamond Pad Conditioner X X
S50 Diamond Pad Conditioner X X
S60 Diamond Pad Conditioner X
S98 Diamond Pad Conditioner X X
E81 Diamond Pad Conditioner Ring X X X
E221 Diamond Pad Conditioner Ring X X X
E187 Diamond Pad Conditioner Ring X X X X
R100 Series Diamond Pad Conditioner Rings X X X
R400 Series Diamond Pad Conditioner X X X
A1000 Series Diamond Pad Conditioner X X X
A2000 Series Diamond Pad Conditioner X X X X
A3000 Series Diamond Pad Conditioner X X X
E3000 Series Diamond Pad Conditioner Rings X X X
PB Series Conditioning Brushes X X X